Design of electronic boxes

Tutorial Beginner 10 minutes to read 📅 Updated 24 March 2026

Design of electronic enclosures

A good electronic enclosure design will ensure the long-term success of your electronic project. Thoughtful planning and testing must be included in the design of any industrial electronic enclosure.

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Good electronics enclosure design will ensure the long-term success of your electronics project. Careful planning and testing must be included in the design of any industrial electronics package.

1. Getting the right size

1. Using the right materials

1. Respecting the transmission of signals

1. Check the layout of the components

1. Ensure compatibility with the Bill of Materials (BOM).

Getting the right size

To create a conceptual 3D file, in order to verify that the electronic enclosure's size corresponds to its intended use and the space allocated in a potential higher-level assembly. It is important, at this stage, to ensure that the electronic enclosure will fulfil the safety and functionality requirements within the planned budget.

Choose the most suitable material for the product

For indoor or outdoor use, whether positioned as «premium» or «entry-level», the casing will not meet the same specifications and will not benefit from the same budget in terms of materials used.
The thermoplastic"thermoplastics allow a freedom of form not achievable with steel casings. Furthermore, outdoor use will be easier, due to the absence of corrosion.

When it comes to choosing the material, usage and environment are the key words:

- Indoor or outdoor (UV resistant)

- Under water or underground (waterproofing to be observed: IP65, IP68, IP44)

- Temperature extremes

- High humidity

- Mechanical stress

- Vibrational behaviour

Ensuring the transmission of signals

Thermoplastic cases are better able to pass bluetooth or wifi (wireless) signals than metal cases.

It is also possible to choose materials with electromagnetic radiation shielding.

Design is not everything

The positioning of components on the PCB must also be taken into account for the casing design. Likewise, support areas, openings for connectors, and ventilation areas must be judiciously positioned, according to the product's specifications.

Your client will ask for a compact, aesthetically pleasing case, okay, no problem! But a non-functional case won't bring satisfaction if, in the end, the PCB isn't used in an optimum configuration.

Compare the 3D design of the card with the BOM!

Unfortunately, it often happens that the PCB’s 3D file does not match the 100% in the Gerber file’s bill of materials (BOM). It’s always a good idea to allow for a little extra space!

Call on us for your single and bi-material injection moulded boxes.

Our design office will support you in the design and industrialisation stages of your cases indoor, outdoor, waterproof.
Our team will also be able to offer you alternatives to aluminium radiators, by adopting heat-conducting thermoplastics.

❓ Frequently Asked Questions

What design rules for an electronic plastic enclosure?

Designing an electronic enclosure requires planning for: uniform wall thickness (1.5 to 3 mm typical), stiffening ribs, bosses for inserts or screws with validated geometric ratios, draft angles of at least 1° for demoulding, and maintenance access areas. Mechanical integration of the PCB must be anticipated.

How to size a plastic enclosure for electronics?

The sizing starts from the constraints: PCB size, external connectors, thermal dissipation, sealing, maintenance access, wall or DIN mounting. Tolerance margins (1-2 mm around the PCB), cable routing, and internal mounting points for the PCB and accessories are then planned.

What IP ratings for an injected electronic housing?

Common Ingress Protection (IP) ratings in plastic injection moulding range from IP20 (dry indoor environments) to IP65/IP67 (dust-tight and protected against water jets). Beyond IP65, seals, seal housing reliefs, and grooved designs are required. IP68 can still be achieved with ultrasonic welding or bonding.

How to integrate thermal management into a plastic enclosure?

Thermal management of a plastic enclosure is achieved through ventilation grilles, associated metal heatsinks, direct contact with hot components, or thermally conductive polymers. For high power levels, incorporate controlled air return, or even combine plastic and metal in a bimetallic design to dissipate heat.

Which material to choose for an electronic housing (ABS, PC or PA)?

ABS is suitable for cost-effective indoor enclosures. PC offers better impact resistance and higher thermal stability. The PC/ABS blend combines these advantages and is widely used in consumer electronics. PA is suitable for demanding technical parts. For flame retardancy, choose a grade certified V0 according to UL94.

How to ensure the waterproofing of an injected electronic enclosure?

The watertightness of a casing is achieved through: a compressed gasket (silicone, EPDM) in a groove, ultrasonic welding (perfect watertightness), peripheral bonding, or bi-injection of a TPE gasket directly onto the structural part. The choice depends on the target IP rating, the acceptable cost, and the need for subsequent disassembly of the casing.